- (A) Rapid solidification of metal
- (B) No place for reservoirs
- (C) Incomplete evacuation of gases
- (D) Difficulty in removing casting from investment
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- (A) William H Taggart
- (B) Buonocore
- (C) G.V. Black
- (D) Bowen
- (A) Candellila wax
- (B) Paraffin wax
- (C) Carnauba wax
- (D) Gum dammar
- (A) Prevent the oxidation of the metal during melting
- (B) increase the melting point of the flux
- (C) Flaring the point of the sprue attachment
- (D) None of the above
- (A) Suckback porosity
- (B) Gas inclusion porosity
- (C) Localized shrinkage porosity
- (D) Microporosity
- (A) N 25%
- (B) 25%
- (C) >40%
- (D) 0%
- (A) It prevents the formation of copper oxide
- (B) It prevents the formation of chromium oxide or dissolves chromic oxide layer
- (C) It prevents the flow of material in undesirable area
- (D) Increase the strength of solder
- (A) Palladium
- (B) Silver
- (C) Copper
- (D) Zinc
- (A) To felicitate wetting of ring liner
- (B) To felicitate mixing investment
- (C) To reduce contact angle of liquid with max surface
- (D) For better wax elimination
- (A) 0%
- (B) 2 to 3%
- (C) 5 to 10%
- (D) <1%
