- (A) Low weight
- (B) Low cost
- (C) Low strength
- (D) Low melting point
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- (A) Gold solder and borax flux
- (B) Gold solder and fluoride flux
- (C) Silver Solder and borax flux
- (D) Silver solder and fluoride flux
- (A) Propane
- (B) Acetylene
- (C) Natural gas
- (D) Hydrogen
- (A) Hydrogen
- (B) Natural gas
- (C) Propane
- (D) Acetylene
- (A) Soft hardening treatment
- (B) Hard hardening treatment
- (C) Precipitating heat treatment
- (D) Stress relieving heat treatment
- (A) Increase the strength
- (B) Counter balance contraction of gypsum during heating
- (C) aid in hygroscopic expansion
- (D) Increase the shelf life of investment
- (A) 11.5-12.5×10-6/°C
- (B) 10.5-11.5×10-6/°C
- (C) 13.5-14.5×10-6/°C
- (D) 16.5-17.5×10-6/°C
- (A) Gold-Copper
- (B) Nickel-Chromium
- (C) Nickel-Titanium
- (D) Silver-Palladium
- (A) Recovery recrystallization grain growth
- (B) Recrystallization recovery, grain growth
- (C) Grain Growth Recrystallization recovery
- (D) Melting point, grain growth, Recrystallization
- (A) Strengtherner
- (B) Hardener
- (C) Whitens the alloy
- (D) Scavenger
