- (A) Decreased strength
- (B) Decreased film thickness
- (C) Decreased solubility
- (D) Increased setting time
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- (A) Composites
- (B) Direct filling resins
- (C) Polycarboxylate cements
- (D) BIS-GMA resins in pit and fissure sealants
- (A) Polysiloxane
- (B) Phosphoric acid
- (C) Polyacrylic acid
- (D) Ion leachable glass
- (A) Zinc oxide eugenol
- (B) Zinc polycarboxylate
- (C) SIlicate
- (D) Glass ionomer
- (E) Both B & D
- (A) Acetic acid
- (B) Alginic acid
- (C) Phosphoric acid
- (D) Ortho-ethoxy acid
- (A) Amalgam
- (B) Silicate
- (C) Composite resin
- (D) Cavity varnish
- (A) 38-42%
- (B) 48-52%
- (C) 58-62%
- (D) 68-72%
- (A) Dissolve the alloy in mercury
- (B) Coat the alloy particle with mercury
- (C) Remove excess mercury from the amalgam
- (D) Dissolve Hg in alloy
- (A) Silver
- (B) Tin
- (C) Zinc
- (D) Copper
- (A) Have less marginal breakdown
- (B) Are workable at lower Hg-alloy ratio
- (C) Have a higher ratio of tensile to compressive strength
- (D) Have less resistance to tarnish and corrosion
